Datasheets
HM66AEB36104BP-30 by: Renesas Electronics Corporation

1MX36 DDR SRAM, 0.45ns, PBGA165, PLASTIC, FBGA-165

Part Details for HM66AEB36104BP-30 by Renesas Electronics Corporation

Overview of HM66AEB36104BP-30 by Renesas Electronics Corporation

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Part Details for HM66AEB36104BP-30

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HM66AEB36104BP-30 Part Data Attributes

HM66AEB36104BP-30 Renesas Electronics Corporation
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HM66AEB36104BP-30 Renesas Electronics Corporation 1MX36 DDR SRAM, 0.45ns, PBGA165, PLASTIC, FBGA-165
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer RENESAS TECHNOLOGY CORP
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Clock Frequency-Max (fCLK) 333 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
Length 17 mm
Memory Density 37748736 bit
Memory IC Type DDR SRAM
Memory Width 36
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 165
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.46 mm
Standby Current-Max 0.35 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.88 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 15 mm

Alternate Parts for HM66AEB36104BP-30

This table gives cross-reference parts and alternative options found for HM66AEB36104BP-30. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM66AEB36104BP-30, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY7C1372AV25-100BGC ZBT SRAM, 1MX18, 5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, FBGA-119 Cypress Semiconductor HM66AEB36104BP-30 vs CY7C1372AV25-100BGC
K7B401825A-TC65 Cache SRAM, 256KX18, 6.5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 Samsung Semiconductor HM66AEB36104BP-30 vs K7B401825A-TC65
MT58V2MV18FF-7.5 Standard SRAM, 2MX18, 7.5ns, CMOS, PBGA165, 13 X 15 MM, MO-216, FBGA-165 Micron Technology Inc HM66AEB36104BP-30 vs MT58V2MV18FF-7.5
UPD44164364F5-E30-EQ1 DDR SRAM, 512KX36, 0.27ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, FBGA-165 NEC Electronics Group HM66AEB36104BP-30 vs UPD44164364F5-E30-EQ1
MCM69R819ZP6 256KX18 CACHE SRAM, 3ns, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 Motorola Mobility LLC HM66AEB36104BP-30 vs MCM69R819ZP6
CY7C1305BV18-133BZC QDR SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165 Cypress Semiconductor HM66AEB36104BP-30 vs CY7C1305BV18-133BZC
CY7C1381AV25-117AC Standard SRAM, 512KX36, 7.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Cypress Semiconductor HM66AEB36104BP-30 vs CY7C1381AV25-117AC
UPD44322182F1-A44Y-FQ2 Cache SRAM, 2MX18, 2.8ns, CMOS, PBGA165, 15 X 17 MM, PLASTIC, FBGA-165 NEC Electronics Group HM66AEB36104BP-30 vs UPD44322182F1-A44Y-FQ2
KM718V787T-10 Cache SRAM, 128KX18, 10ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 Samsung Semiconductor HM66AEB36104BP-30 vs KM718V787T-10
71V3578YS150BGGI Cache SRAM, 256KX18, 3.8ns, CMOS, PBGA119, ROHS COMPLIANT, BGA-119 Integrated Device Technology Inc HM66AEB36104BP-30 vs 71V3578YS150BGGI

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