CY7C1305BV18-133BZC
vs
IS61LPD51236-250B2I
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
BGA
Package Description
13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165
BGA,
Pin Count
165
119
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3 ns
2.6 ns
Additional Feature
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
R-PBGA-B119
JESD-609 Code
e0
e0
Length
15 mm
22 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
QDR SRAM
CACHE SRAM
Memory Width
18
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
165
119
Number of Words
1048576 words
524288 words
Number of Words Code
1000000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1MX18
512KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
2.41 mm
Supply Voltage-Max (Vsup)
1.9 V
3.465 V
Supply Voltage-Min (Vsup)
1.7 V
3.135 V
Supply Voltage-Nom (Vsup)
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
14 mm
Base Number Matches
1
1
Compare CY7C1305BV18-133BZC with alternatives
Compare IS61LPD51236-250B2I with alternatives