CY7C1305BV18-133BZC
vs
IS61SF12832-8B
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
INTEGRATED CIRCUIT SOLUTION INC
Part Package Code
BGA
Package Description
13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165
BGA, BGA119,7X17,50
Pin Count
165
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3 ns
8 ns
Additional Feature
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
R-PBGA-B119
JESD-609 Code
e0
e0
Length
15 mm
Memory Density
18874368 bit
4194304 bit
Memory IC Type
QDR SRAM
STANDARD SRAM
Memory Width
18
32
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
165
119
Number of Words
1048576 words
131072 words
Number of Words Code
1000000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX18
128KX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
Base Number Matches
1
2
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
BGA119,7X17,50
Standby Current-Max
0.01 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.25 mA
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