HEF40373BDF vs 74LVC1G126GF,132 feature comparison

HEF40373BDF NXP Semiconductors

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74LVC1G126GF,132 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIP SON
Package Description DIP, 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6
Pin Count 20 6
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 LVC/LCX/Z
JESD-30 Code R-GDIP-T20 R-PDSO-N6
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 1
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP VSON
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, VERY THIN PROFILE
Propagation Delay (tpd) 300 ns 10.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 0.5 mm
Supply Voltage-Max (Vsup) 15 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 1.65 V
Supply Voltage-Nom (Vsup) 5 V 1.8 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 0.35 mm
Terminal Position DUAL DUAL
Width 7.62 mm 1 mm
Base Number Matches 1 1
Rohs Code Yes
Manufacturer Package Code SOT891
Factory Lead Time 4 Weeks
Control Type ENABLE HIGH
JESD-609 Code e3
Length 1 mm
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code SOLCC6,.04,14
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 6 ns
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30

Compare HEF40373BDF with alternatives

Compare 74LVC1G126GF,132 with alternatives