HEF40373BDF
vs
HEF40373BTD-T
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
NEXPERIA
|
PHILIPS SEMICONDUCTORS
|
Package Description |
DIP,
|
SOP, SOP20,.4
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2017-02-01
|
|
Family |
4000/14000/40000
|
|
JESD-30 Code |
R-CDIP-T20
|
R-PDSO-G20
|
Logic IC Type |
BUS DRIVER
|
D LATCH
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Propagation Delay (tpd) |
300 ns
|
|
Seated Height-Max |
5.08 mm
|
|
Supply Voltage-Max (Vsup) |
15 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
|
Base Number Matches |
2
|
3
|
Rohs Code |
|
Yes
|
Max I(ol) |
|
0.00175 A
|
Moisture Sensitivity Level |
|
1
|
Package Equivalence Code |
|
SOP20,.4
|
Packing Method |
|
TR
|
Peak Reflow Temperature (Cel) |
|
260
|
Power Supply Current-Max (ICC) |
|
100 mA
|
Prop. Delay@Nom-Sup |
|
300 ns
|
Qualification Status |
|
Not Qualified
|
|
|
|
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