HEF40373BDF
vs
HEF40373BP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP,
PLASTIC, SOT-146-1, DIP-20
Pin Count
20
20
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T20
R-PDIP-T20
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
300 ns
300 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
4.2 mm
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
3
Pbfree Code
Rohs Code
Additional Feature
IOH = 9.3MA @ VOH = 3.6V
JESD-609 Code
e4
Length
26.73 mm
Max I(ol)
0.00175 A
Package Equivalence Code
DIP20,.3
Power Supply Current-Max (ICC)
100 mA
Prop. Delay@Nom-Sup
300 ns
Terminal Finish
NICKEL PALLADIUM GOLD
Compare HEF40373BDF with alternatives
Compare HEF40373BP with alternatives