HD74HC74FP-EL vs TC74HC74AF feature comparison

HD74HC74FP-EL Renesas Electronics Corporation

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TC74HC74AF Toshiba America Electronic Components

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 10.06 mm 10.3 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 2 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 200 ns 190 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 5.3 mm
Base Number Matches 2 1
Rohs Code No
HTS Code 8542.39.00.01
Samacsys Manufacturer Toshiba
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 25000000 Hz
Max I(ol) 0.004 A
Package Equivalence Code SOP14,.3
Packing Method TUBE
Terminal Finish TIN LEAD
fmax-Min 29 MHz

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