HD74HC1G08-EL vs 74AHCT1G08DCKTE4 feature comparison

HD74HC1G08-EL Renesas Electronics Corporation

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74AHCT1G08DCKTE4 Texas Instruments

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC SOIC
Package Description TSSOP, TSSOP, TSSOP5/6,.08
Pin Count 5 5
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH AHCT/VHCT/VT
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e6 e4
Length 2 mm 2 mm
Logic IC Type AND GATE AND GATE
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 125 ns 9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN BISMUTH NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.25 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Package Equivalence Code TSSOP5/6,.08
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 9 ns
Schmitt Trigger NO
Time@Peak Reflow Temperature-Max (s) 30

Compare HD74HC1G08-EL with alternatives

Compare 74AHCT1G08DCKTE4 with alternatives