HD74HC1G08-EL
vs
NC7S08P5_NL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
SOIC
SOIC
Package Description
TSSOP,
TSSOP,
Pin Count
5
5
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e6
Length
2 mm
2 mm
Logic IC Type
AND GATE
AND GATE
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
5
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
125 ns
125 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN BISMUTH
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
1.25 mm
1.25 mm
Base Number Matches
2
1
Compare HD74HC1G08-EL with alternatives
Compare NC7S08P5_NL with alternatives