HD74HC1G08-EL
vs
74HC1G08GW,125
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
NXP SEMICONDUCTORS
Part Package Code
SOIC
TSSOP
Package Description
TSSOP,
PLASTIC, SC-88A, 5 PIN
Pin Count
5
5
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e6
e3
Length
2 mm
2 mm
Logic IC Type
AND GATE
AND GATE
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
5
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
125 ns
135 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
TIN BISMUTH
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
1.25 mm
1.25 mm
Base Number Matches
2
2
Rohs Code
Manufacturer Package Code
SOT353-1
Load Capacitance (CL)
50 pF
Max I(ol)
0.002 A
Moisture Sensitivity Level
1
Package Equivalence Code
TSSOP5/6,.08
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
27 ns
Schmitt Trigger
NO
Time@Peak Reflow Temperature-Max (s)
30
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