HCPL-7820OPTION300
vs
HCPL-7850100
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
HEWLETT PACKARD CO
AGILENT TECHNOLOGIES INC
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOI,
Pin Count
8
8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.33.00.01
Amplifier Type
ISOLATION AMPLIFIER
ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom
200 MHz
100 MHz
Common Mode Voltage-Max
3750 V
Isolation Voltage-Min
3750 V
JESD-30 Code
R-PDSO-G8
R-PDSO-B8
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOI
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage Limit-Max
5.5 V
5.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
GULL WING
BUTT
Terminal Position
DUAL
DUAL
Voltage Gain-Max
8.4
8.4
Voltage Gain-Min
7.6
7.6
Base Number Matches
4
3
Rohs Code
Length
9.655 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
4.32 mm
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Compare HCPL-7820OPTION300 with alternatives
Compare HCPL-7850100 with alternatives