HCPL-7820OPTION300
vs
HCPL-7851200
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
HEWLETT PACKARD CO
HEWLETT PACKARD CO
Part Package Code
SOIC
DIP
Package Description
SOP,
SOJ, SMDIP8,.3
Pin Count
8
8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
ISOLATION AMPLIFIER
ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom
200 MHz
100 MHz
Common Mode Voltage-Max
3750 V
Isolation Voltage-Min
3750 V
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
100 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOJ
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage Limit-Max
5.5 V
5.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
HYBRID
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Voltage Gain-Max
8.4
8.4
Voltage Gain-Min
7.6
7.6
Base Number Matches
4
3
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
SMDIP8,.3
Screening Level
38535Q/M;38534H;883B
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Compare HCPL-7820OPTION300 with alternatives
Compare HCPL-7851200 with alternatives