HCPL-7850100
vs
HCPL-7850#100
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
AGILENT TECHNOLOGIES INC
BROADCOM INC
Part Package Code
SOIC
Package Description
SOI,
DIP, SMDIP8,.3
Pin Count
8
Reach Compliance Code
unknown
compliant
Amplifier Type
ISOLATION AMPLIFIER
ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom
100 MHz
0.1 MHz
JESD-30 Code
R-PDSO-B8
R-CDIP-T8
Length
9.655 mm
9.655 mm
Number of Functions
1
1
Number of Terminals
8
8
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOI
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.32 mm
4.32 mm
Supply Voltage Limit-Max
5.5 V
5.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Terminal Form
BUTT
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Gain-Max
8.4
8.4
Voltage Gain-Min
7.6
7.6
Width
7.62 mm
7.62 mm
Base Number Matches
3
3
ECCN Code
EAR99
HTS Code
8542.33.00.01
Factory Lead Time
8 Weeks
Common Mode Voltage-Max
2.8 V
JESD-609 Code
e4
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Equivalence Code
SMDIP8,.3
Technology
HYBRID
Temperature Grade
MILITARY
Terminal Finish
GOLD
Compare HCPL-7850100 with alternatives
Compare HCPL-7850#100 with alternatives