GS88218CD-300M
vs
UPD4481322F9-C50-EQX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
NEC ELECTRONICS CORP
Part Package Code
BGA
BGA
Package Description
LBGA,
BGA,
Pin Count
165
165
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.B
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
24 Weeks
Access Time-Max
5 ns
3.2 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT CAN ALSO OPERATES AT AS 3.3 V SUPPLY
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
15 mm
15 mm
Memory Density
9437184 bit
8388608 bit
Memory IC Type
CACHE SRAM
ZBT SRAM
Memory Width
18
32
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
524288 words
262144 words
Number of Words Code
512000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
512KX18
256KX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
Supply Voltage-Max (Vsup)
2.7 V
2.625 V
Supply Voltage-Min (Vsup)
2.3 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
13 mm
13 mm
Base Number Matches
2
1
Compare GS88218CD-300M with alternatives
Compare UPD4481322F9-C50-EQX with alternatives