UPD4481322F9-C50-EQX
vs
IDT71T67702S80BQ
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NEC ELECTRONICS CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
BGA,
TBGA,
Pin Count
165
165
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.2 ns
8 ns
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
15 mm
15 mm
Memory Density
8388608 bit
9437184 bit
Memory IC Type
ZBT SRAM
CACHE SRAM
Memory Width
32
36
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX32
256KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e0
Moisture Sensitivity Level
3
Seated Height-Max
1.2 mm
Terminal Finish
TIN LEAD
Compare UPD4481322F9-C50-EQX with alternatives
Compare IDT71T67702S80BQ with alternatives