UPD4481322F9-C50-EQX
vs
71V65603150PFG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NEC ELECTRONICS CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
QFP
Package Description
BGA,
LQFP,
Pin Count
165
100
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.2 ns
3.8 ns
JESD-30 Code
R-PBGA-B165
R-PQFP-G100
Length
15 mm
20 mm
Memory Density
8388608 bit
9437184 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
32
36
Number of Functions
1
1
Number of Terminals
165
100
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX32
256KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LQFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
2.625 V
3.465 V
Supply Voltage-Min (Vsup)
2.375 V
3.135 V
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Width
13 mm
14 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Additional Feature
PIPELINED ARCHITECTURE
JESD-609 Code
e3
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.6 mm
Terminal Finish
Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare UPD4481322F9-C50-EQX with alternatives
Compare 71V65603150PFG with alternatives