GD80960JT-100
vs
MC68SZ328VH66V
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
PLASTIC, BGA-196
|
12 X 12 MM, 0.80 MM PITCH, MAPBGA-196
|
| Pin Count |
196
|
196
|
| Reach Compliance Code |
compliant
|
unknown
|
| Additional Feature |
BURST BUS
|
|
| Address Bus Width |
32
|
25
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
NO
|
| Clock Frequency-Max |
33.3 MHz
|
16 MHz
|
| External Data Bus Width |
32
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B196
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
1
|
|
| Number of Terminals |
196
|
196
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LFBGA
|
| Package Equivalence Code |
BGA196(UNSPEC)
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Power Supplies |
3.3,3.3/5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
100 MHz
|
66.32 MHz
|
| Supply Current-Max |
600 mA
|
|
| Supply Voltage-Max |
3.45 V
|
3.3 V
|
| Supply Voltage-Min |
3.15 V
|
2.7 V
|
| Supply Voltage-Nom |
3.3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
3
|
| HTS Code |
|
8542.31.00.01
|
| Length |
|
12 mm
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Seated Height-Max |
|
1.36 mm
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Pitch |
|
0.8 mm
|
| Width |
|
12 mm
|
|
|
|
Compare GD80960JT-100 with alternatives
Compare MC68SZ328VH66V with alternatives