GD80960JT-100
vs
MCF5270CVM150R2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEL CORP
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
PLASTIC, BGA-196
ROHS COMPLIANT, MAPBGA-196
Pin Count
196
196
Reach Compliance Code
compliant
compliant
Additional Feature
BURST BUS
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
24
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
33.3 MHz
75 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
3
Number of Terminals
196
196
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA196(UNSPEC)
BGA196,14X14,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
225
260
Power Supplies
3.3,3.3/5 V
Qualification Status
Not Qualified
Not Qualified
Speed
100 MHz
150 MHz
Supply Current-Max
600 mA
Supply Voltage-Max
3.45 V
1.6 V
Supply Voltage-Min
3.15 V
1.4 V
Supply Voltage-Nom
3.3 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Pbfree Code
ECCN Code
5A992
HTS Code
8542.31.00.01
Length
15 mm
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Seated Height-Max
1.6 mm
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER OVER NICKEL
Terminal Pitch
1 mm
Width
15 mm
Compare GD80960JT-100 with alternatives
Compare MCF5270CVM150R2 with alternatives