GD80960JT-100 vs MCF5270CVM150R2 feature comparison

GD80960JT-100 Intel Corporation

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MCF5270CVM150R2 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer INTEL CORP NXP SEMICONDUCTORS
Part Package Code BGA
Package Description PLASTIC, BGA-196 ROHS COMPLIANT, MAPBGA-196
Pin Count 196
Reach Compliance Code compliant compliant
Additional Feature BURST BUS ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32 24
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 33.3 MHz 75 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B196 S-PBGA-B196
Low Power Mode YES YES
Moisture Sensitivity Level 1 3
Number of Terminals 196 196
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA196(UNSPEC)
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Power Supplies 3.3,3.3/5 V
Qualification Status Not Qualified Not Qualified
Speed 100 MHz 150 MHz
Supply Current-Max 600 mA
Supply Voltage-Max 3.45 V 1.6 V
Supply Voltage-Min 3.15 V 1.4 V
Supply Voltage-Nom 3.3 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Factory Lead Time 13 Weeks
JESD-609 Code e1
Length 15 mm
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Seated Height-Max 1.6 mm
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Pitch 1 mm
Width 15 mm

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