GD80960JA33
vs
SCF5250VM120
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTEL CORP
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA, BGA196(UNSPEC)
|
15 X 15 MM, 1 MM PITCH, LEAD FREE, MAPBGA-196
|
Pin Count |
196
|
196
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
25
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
33.3 MHz
|
33.86 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B196
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
196
|
196
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Equivalence Code |
BGA196(UNSPEC)
|
BGA196,14X14,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Speed |
33 MHz
|
120 MHz
|
Supply Current-Max |
320 mA
|
|
Supply Voltage-Max |
3.45 V
|
1.32 V
|
Supply Voltage-Min |
3.15 V
|
1.08 V
|
Supply Voltage-Nom |
3.3 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Additional Feature |
|
ALSO REQUIRES 3.3V SUPPLY
|
Length |
|
15 mm
|
Moisture Sensitivity Level |
|
3
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
1.6 mm
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
TIN SILVER COPPER OVER NICKEL
|
Terminal Pitch |
|
1 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
15 mm
|
|
|
|
Compare GD80960JA33 with alternatives
Compare SCF5250VM120 with alternatives