EPF8820ARC208-4N
vs
EPF8820ABC225-4
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
QFP
BGA
Package Description
FQFP,
BGA-225
Pin Count
208
225
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
JESD-30 Code
S-PQFP-G208
S-PBGA-B225
JESD-609 Code
e3
e0
Length
28 mm
27 mm
Number of Dedicated Inputs
4
4
Number of I/O Lines
152
152
Number of Terminals
208
225
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4 DEDICATED INPUTS, 152 I/O
4 DEDICATED INPUTS, 152 I/O
Output Function
REGISTERED
REGISTERED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
BGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
GRID ARRAY
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
2.3 mm
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1.5 mm
Terminal Position
QUAD
BOTTOM
Width
28 mm
27 mm
Base Number Matches
1
2
Clock Frequency-Max
357 MHz
Moisture Sensitivity Level
3
Number of Inputs
152
Number of Logic Cells
672
Number of Outputs
148
Package Equivalence Code
BGA225,15X15
Peak Reflow Temperature (Cel)
220
Compare EPF8820ARC208-4N with alternatives
Compare EPF8820ABC225-4 with alternatives