EPF8820ABC225-4
vs
EPF8820ARI208-3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
BGA
QFP
Package Description
BGA-225
HFQFP, HQFP208,1.2SQ,20
Pin Count
225
208
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max
357 MHz
385 MHz
JESD-30 Code
S-PBGA-B225
S-PQFP-G208
JESD-609 Code
e0
e0
Length
27 mm
28 mm
Moisture Sensitivity Level
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
152
152
Number of Inputs
152
152
Number of Logic Cells
672
672
Number of Outputs
148
148
Number of Terminals
225
208
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
4 DEDICATED INPUTS, 152 I/O
4 DEDICATED INPUTS, 152 I/O
Output Function
REGISTERED
REGISTERED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
HFQFP
Package Equivalence Code
BGA225,15X15
HQFP208,1.2SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, HEAT SINK/SLUG, FINE PITCH
Peak Reflow Temperature (Cel)
220
220
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.3 mm
4.1 mm
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1.5 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
27 mm
28 mm
Base Number Matches
2
1
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Compare EPF8820ARI208-3 with alternatives