Findchips: Compare EP1C12F324C8 vs EP1C12F324C7N

EP1C12F324C8 vs EP1C12F324C7N feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	INTEL CORP	INTEL CORP
Package Description	FBGA-324	FBGA-324
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	275 MHz	320 MHz
JESD-30 Code	S-PBGA-B324	S-PBGA-B324
JESD-609 Code	e0	e1
Length	19 mm	19 mm
Moisture Sensitivity Level	3	3
Number of CLBs	1206	1206
Number of Inputs	249	249
Number of Logic Cells	12060	12060
Number of Outputs	249	249
Number of Terminals	324	324
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min
Organization	1206 CLBS	1206 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA324,18X18,40	BGA324,18X18,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.2 mm	2.2 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Temperature Grade	OTHER	OTHER
Terminal Finish	TIN LEAD	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	19 mm	19 mm
Base Number Matches	3	1
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays