EP1C12F324C8
vs
EP1C12F324C6N
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
FBGA-324
|
FBGA-324
|
| Pin Count |
324
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
275 MHz
|
405 MHz
|
| JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
| JESD-609 Code |
e0
|
e1
|
| Length |
19 mm
|
19 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
1206
|
1206
|
| Number of Inputs |
249
|
249
|
| Number of Logic Cells |
12060
|
12060
|
| Number of Outputs |
249
|
249
|
| Number of Terminals |
324
|
324
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1206 CLBS
|
1206 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA324,18X18,40
|
BGA324,18X18,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
220
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.2 mm
|
2.2 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
19 mm
|
19 mm
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
3A991
|
| Samacsys Manufacturer |
|
Intel
|
|
|
|
Compare EP1C12F324C8 with alternatives
Compare EP1C12F324C6N with alternatives