EP1C12F324C8
vs
EP1C12F324C6ES
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
FBGA-324
BGA,
Pin Count
324
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
275 MHz
405 MHz
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e0
e0
Length
19 mm
19 mm
Moisture Sensitivity Level
3
Number of CLBs
1206
12060
Number of Inputs
249
Number of Logic Cells
12060
Number of Outputs
249
Number of Terminals
324
324
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
1206 CLBS
12060 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA324,18X18,40
BGA324,18X18,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
2.2 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Temperature Grade
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
19 mm
19 mm
Base Number Matches
2
2
Compare EP1C12F324C8 with alternatives
Compare EP1C12F324C6ES with alternatives