DS7831MD8
vs
AM26LS30MF
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
| Package Description |
DIE, DIE OR CHIP
|
DIP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
CONFIGURABLE INTERFACE STANDARDS; INDIVIDUAL ENABLES
|
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
2
|
4
|
| High Level Input Current-Max |
0.001 A
|
|
| Input Characteristics |
GATED
|
STANDARD
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
GENERAL PURPOSE
|
EIA-422; EIA-423
|
| JESD-30 Code |
X-XUUC-N
|
R-GDIP-T16
|
| Number of Functions |
2
|
4
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Out Swing-Min |
2 V
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIE
|
DIP
|
| Package Equivalence Code |
DIE OR CHIP
|
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
|
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Position |
UPPER
|
DUAL
|
| Transmit Delay-Max |
25 ns
|
200 ns
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
16
|
| Length |
|
19.535 mm
|
| Number of Terminals |
|
16
|
| Output Polarity |
|
COMPLEMENTARY
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Current-Max |
|
30 mA
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
7.62 mm
|
|
|
|
Compare DS7831MD8 with alternatives
Compare AM26LS30MF with alternatives