AM26LS30MF vs DS1691J feature comparison

AM26LS30MF NXP Semiconductors

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DS1691J Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output YES YES
Driver Number of Bits 4 2
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422; EIA-423 EIA-422; EIA-423
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Length 19.535 mm 19.43 mm
Number of Functions 4 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Output Characteristics 3-STATE
Output Polarity COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 30 mA
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR TTL
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Transmit Delay-Max 200 ns
Width 7.62 mm 7.62 mm
Base Number Matches 2 3
JESD-609 Code e0
Supply Voltage1-Nom -5 V
Terminal Finish TIN LEAD

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