AM26LS30MF
vs
AM26LS30FN
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
QCCJ, LDCC20,.4SQ
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
4
|
4
|
| Input Characteristics |
STANDARD
|
STANDARD
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
EIA-422; EIA-423
|
EIA-422-A; EIA-423-A
|
| JESD-30 Code |
R-GDIP-T16
|
S-PQCC-J20
|
| Length |
19.535 mm
|
8.965 mm
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Equivalence Code |
DIP16,.3
|
LDCC20,.4SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
4.57 mm
|
| Supply Current-Max |
30 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Transmit Delay-Max |
200 ns
|
200 ns
|
| Width |
7.62 mm
|
8.965 mm
|
| Base Number Matches |
2
|
5
|
| Rohs Code |
|
No
|
| Additional Feature |
|
CONFIGURABLE INTERFACE STANDARDS
|
| High Level Input Current-Max |
|
0.00004 A
|
| JESD-609 Code |
|
e0
|
| Out Swing-Min |
|
2 V
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare AM26LS30MF with alternatives
Compare AM26LS30FN with alternatives