CY7C263-55WMB vs F356435S feature comparison

CY7C263-55WMB Cypress Semiconductor

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F356435S Fairchild Semiconductor Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP FAIRCHILD SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description WDIP, DIP24,.3 DIP,
Pin Count 24 24
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.71
Access Time-Max 55 ns 200 ns
Additional Feature POWER SWITCHED PROM
I/O Type COMMON
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0
Length 31.877 mm 32.0675 mm
Memory Density 65536 bit 1048576 bit
Memory IC Type UVPROM MASK ROM
Memory Width 8 8
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 6.37 mm
Standby Current-Max 0.03 A
Supply Current-Max 0.12 mA 0.04 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS NMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 15.24 mm
Base Number Matches 1 1

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