CY7C199CN-20ZXIT
vs
P4C1256-25TI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
PYRAMID SEMICONDUCTOR CORP
Part Package Code
TSOP
TSOP
Package Description
LEAD FREE, PLASTIC, TSOP1-28
8 X 13.40 MM, PLASTIC, TSOP-28
Pin Count
28
28
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
25 ns
I/O Type
COMMON
JESD-30 Code
R-PDSO-G28
R-PDSO-G28
JESD-609 Code
e4
e0
Length
11.8 mm
11.811 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Equivalence Code
TSSOP28,.53,22
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.1938 mm
Standby Current-Max
0.0005 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.075 mA
0.16 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.55 mm
0.55 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
8 mm
8.001 mm
Base Number Matches
2
1
Pbfree Code
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