P4C1256-25TI
vs
5962-9318713HXC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
AEROFLEX COLORADO SPRINGS
Part Package Code
TSOP
PGA
Package Description
8 X 13.40 MM, PLASTIC, TSOP-28
HIP,
Pin Count
28
66
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
45 ns
JESD-30 Code
R-PDSO-G28
S-XHIP-P66
JESD-609 Code
e0
e4
Length
11.811 mm
30.1 mm
Memory Density
262144 bit
4194304 bit
Memory IC Type
STANDARD SRAM
CACHE SRAM MODULE
Memory Width
8
32
Number of Functions
1
1
Number of Terminals
28
66
Number of Words
32768 words
131072 words
Number of Words Code
32000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
32KX8
128KX32
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSOP1
HIP
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1938 mm
6.22 mm
Supply Current-Max
0.16 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
GOLD
Terminal Form
GULL WING
PIN/PEG
Terminal Pitch
0.55 mm
2.54 mm
Terminal Position
DUAL
HEX
Width
8.001 mm
30.1 mm
Base Number Matches
1
3
Screening Level
MIL-PRF-38535
Compare P4C1256-25TI with alternatives
Compare 5962-9318713HXC with alternatives