CY39200Z388-83MGC
vs
CY39200Z676-125MBC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
BGA-388
27 X 27 MM, 1.6 MM HEIGHT, 1 MM PITCH, FBGA-676
Pin Count
388
676
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
YES
YES
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B676
JESD-609 Code
e0
e0
JTAG BST
YES
YES
Length
35 mm
27 mm
Number of Dedicated Inputs
Number of I/O Lines
294
428
Number of Macro Cells
3072
3072
Number of Terminals
388
676
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
0 DEDICATED INPUTS, 294 I/O
0 DEDICATED INPUTS, 428 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA388,26X26,50
BGA676,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
15 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.46 mm
1.6 mm
Supply Voltage-Max
1.95 V
1.95 V
Supply Voltage-Min
1.65 V
1.65 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
27 mm
Base Number Matches
1
1
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Compare CY39200Z676-125MBC with alternatives