CY39200Z676-125MBC
vs
CY39200Z208-125NTC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
QFP
Package Description
27 X 27 MM, 1.6 MM HEIGHT, 1 MM PITCH, FBGA-676
EQFP-208
Pin Count
676
208
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Category CO2 Kg
11.5
11.5
Compliance Temperature Grade
Commercial: +0C to +70C
Commercial: +0C to +70C
Candidate List Date
2018-06-27
2018-06-27
SVHC Over MCV
7439-92-1
7439-92-1
EFUP
50
50
Additional Feature
YES
YES
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B676
S-PQFP-G208
JESD-609 Code
e0
e0
JTAG BST
YES
YES
Length
27 mm
28 mm
Number of Dedicated Inputs
Number of I/O Lines
428
136
Number of Macro Cells
3072
3072
Number of Terminals
676
208
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
0 DEDICATED INPUTS, 428 I/O
0 DEDICATED INPUTS, 136 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
FQFP
Package Equivalence Code
BGA676,26X26,40
QFP208,1.2SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, FINE PITCH
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
10 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
3.77 mm
Supply Voltage-Max
1.95 V
1.95 V
Supply Voltage-Min
1.65 V
1.65 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
27 mm
28 mm
Base Number Matches
1
1
kg CO2e/kg
11.5
Average Weight (mg)
2363.75
CO2e (mg)
27183.125
Compare CY39200Z676-125MBC with alternatives
Compare CY39200Z208-125NTC with alternatives