CY39200Z676-125MBC
vs
CY39200Z676-181MBC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, 1.6 MM HEIGHT, 1 MM PITCH, FBGA-676
27 X 27 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-676
Pin Count
676
676
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
YES
YES
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B676
S-PBGA-B676
JESD-609 Code
e0
e0
JTAG BST
YES
YES
Length
27 mm
27 mm
Number of Dedicated Inputs
Number of I/O Lines
428
386
Number of Macro Cells
3072
3072
Number of Terminals
676
676
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
0 DEDICATED INPUTS, 428 I/O
0 DEDICATED INPUTS, 386 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA676,26X26,40
BGA676,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Propagation Delay
10 ns
8.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Supply Voltage-Max
1.95 V
1.95 V
Supply Voltage-Min
1.65 V
1.65 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
Base Number Matches
1
1
Moisture Sensitivity Level
3
Compare CY39200Z676-125MBC with alternatives
Compare CY39200Z676-181MBC with alternatives