CY39200Z388-83MGC vs CY39200Z676-83MBI feature comparison

CY39200Z388-83MGC Cypress Semiconductor

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CY39200Z676-83MBI Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description BGA-388 27 X 27 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-676
Pin Count 388 676
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES YES
In-System Programmable YES YES
JESD-30 Code S-PBGA-B388 S-PBGA-B676
JESD-609 Code e0 e0
JTAG BST YES YES
Length 35 mm 27 mm
Number of Dedicated Inputs
Number of I/O Lines 294 386
Number of Macro Cells 3072 3072
Number of Terminals 388 676
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 294 I/O 0 DEDICATED INPUTS, 386 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA388,26X26,50 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 15 ns 15 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.46 mm 1.6 mm
Supply Voltage-Max 1.95 V 1.95 V
Supply Voltage-Min 1.65 V 1.65 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 27 mm
Base Number Matches 1 1

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Compare CY39200Z676-83MBI with alternatives