BUS50
vs
BUV60.MODR1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MOTOROLA INC
TT ELECTRONICS PLC
Package Description
FLANGE MOUNT, O-MBFM-P2
HERMETIC SEALED, METAL, TO-3, 2 PIN
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Case Connection
COLLECTOR
COLLECTOR
Collector Current-Max (IC)
70 A
50 A
Collector-Emitter Voltage-Max
125 V
125 V
Configuration
SINGLE WITH BUILT-IN DIODE
SINGLE
DC Current Gain-Min (hFE)
15
10
JEDEC-95 Code
TO-204AE
TO-204AE
JESD-30 Code
O-MBFM-P2
O-MBFM-P2
JESD-609 Code
e0
e1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
Package Body Material
METAL
METAL
Package Shape
ROUND
ROUND
Package Style
FLANGE MOUNT
FLANGE MOUNT
Polarity/Channel Type
NPN
NPN
Power Dissipation-Max (Abs)
350 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Terminal Finish
Tin/Lead (Sn/Pb)
TIN SILVER COPPER
Terminal Form
PIN/PEG
PIN/PEG
Terminal Position
BOTTOM
BOTTOM
Transistor Application
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
1
Rohs Code
Compare BUS50 with alternatives
Compare BUV60.MODR1 with alternatives