APA300-BG456X79
vs
APA300-BG456B
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
BGA,
|
1.27 MM PITCH, PLASTIC, BGA-456
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
180 MHz
|
|
JESD-30 Code |
S-PBGA-B456
|
S-PBGA-B456
|
Length |
35 mm
|
35 mm
|
Number of Equivalent Gates |
300000
|
300000
|
Number of Terminals |
456
|
456
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
300000 GATES
|
300000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA456,26X26,50
|
BGA456,26X26,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.54 mm
|
2.54 mm
|
Supply Voltage-Max |
2.7 V
|
2.7 V
|
Supply Voltage-Min |
2.3 V
|
2.3 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
ECCN Code |
|
3A001.A.2.C
|
Moisture Sensitivity Level |
|
3
|
Number of Inputs |
|
290
|
Number of Logic Cells |
|
8192
|
Number of Outputs |
|
290
|
Screening Level |
|
MIL-STD-883 Class B
|
|
|
|
Compare APA300-BG456X79 with alternatives
Compare APA300-BG456B with alternatives