APA300-BG456B vs APA300-BG456M feature comparison

APA300-BG456B Microsemi Corporation

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APA300-BG456M Actel Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP ACTEL CORP
Package Description BGA, BGA456,26X26,50 1.27 MM PITCH, PLASTIC, BGA-456
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01
JESD-30 Code S-PBGA-B456 S-PBGA-B456
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 300000 300000
Number of Inputs 290 290
Number of Logic Cells 8192 8192
Number of Outputs 290 290
Number of Terminals 456 456
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 300000 GATES 300000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,26X26,50 BGA456,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Seated Height-Max 2.54 mm 2.54 mm
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.3 V 2.3 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 3 3
Clock Frequency-Max 180 MHz
JESD-609 Code e0
Terminal Finish TIN LEAD

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