Findchips: Compare APA300-BG456B vs APA300-BG456M

APA300-BG456B vs APA300-BG456M feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MICROSEMI CORP	ACTEL CORP
Package Description	BGA, BGA456,26X26,50	1.27 MM PITCH, PLASTIC, BGA-456
Reach Compliance Code	unknown	compliant
ECCN Code	3A001.A.2.C
HTS Code	8542.39.00.01
JESD-30 Code	S-PBGA-B456	S-PBGA-B456
Length	35 mm	35 mm
Moisture Sensitivity Level	3	3
Number of Equivalent Gates	300000	300000
Number of Inputs	290	290
Number of Logic Cells	8192	8192
Number of Outputs	290	290
Number of Terminals	456	456
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Organization	300000 GATES	300000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA456,26X26,50	BGA456,26X26,50
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Screening Level	MIL-STD-883 Class B
Seated Height-Max	2.54 mm	2.54 mm
Supply Voltage-Max	2.7 V	2.7 V
Supply Voltage-Min	2.3 V	2.3 V
Supply Voltage-Nom	2.5 V	2.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	MILITARY
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	35 mm	35 mm
Base Number Matches	3	3
Clock Frequency-Max		180 MHz
JESD-609 Code		e0
Terminal Finish		TIN LEAD
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays