AM2921XC vs SN74LVC138AGQNR feature comparison

AM2921XC AMD

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SN74LVC138AGQNR Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC TEXAS INSTRUMENTS INC
Part Package Code DIE BGA
Package Description DIE, PLASTIC, VFBGA-20
Pin Count 20 20
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family S LVC/LCX/Z
Input Conditioning STANDARD STANDARD
JESD-30 Code R-XUUC-N20 R-PBGA-B20
Load Capacitance (CL) 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE
Output Polarity CONFIGURABLE INVERTED
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE VFBGA
Package Equivalence Code DIE OR CHIP BGA20,4X5,25
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Propagation Delay (tpd) 36 ns 22 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 1.65 V
Supply Voltage-Nom (Vsup) 5 V 1.8 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form NO LEAD BALL
Terminal Position UPPER BOTTOM
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Additional Feature TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS
JESD-609 Code e0
Length 4 mm
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 240
Prop. Delay@Nom-Sup 6.7 ns
Seated Height-Max 1 mm
Terminal Finish TIN LEAD
Terminal Pitch 0.65 mm
Width 3 mm

Compare AM2921XC with alternatives

Compare SN74LVC138AGQNR with alternatives