SN74LVC138AGQNR vs AM25LS2536XM feature comparison

SN74LVC138AGQNR Texas Instruments

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AM25LS2536XM AMD

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC ADVANCED MICRO DEVICES INC
Part Package Code BGA DIE
Package Description PLASTIC, VFBGA-20 DIE,
Pin Count 20 20
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS
Family LVC/LCX/Z LS
Input Conditioning STANDARD REGISTERED
JESD-30 Code R-PBGA-B20 R-XUUC-N20
JESD-609 Code e0
Length 4 mm
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity INVERTED CONFIGURABLE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code VFBGA DIE
Package Equivalence Code BGA20,4X5,25 DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH UNCASED CHIP
Packing Method TR
Peak Reflow Temperature (Cel) 240
Prop. Delay@Nom-Sup 6.7 ns
Propagation Delay (tpd) 22 ns 42 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 4.5 V
Supply Voltage-Nom (Vsup) 1.8 V 5 V
Surface Mount YES YES
Technology CMOS TTL
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form BALL NO LEAD
Terminal Pitch 0.65 mm
Terminal Position BOTTOM UPPER
Width 3 mm
Base Number Matches 1 1
Load Capacitance (CL) 45 pF
Output Characteristics 3-STATE
Power Supply Current-Max (ICC) 56 mA

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