AM27C64-150DCB
vs
HY27UF084G2-TPCB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
SK HYNIX INC
Package Description
DIP,
TSOP1,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.51
Access Time-Max
150 ns
JESD-30 Code
R-CDIP-T28
R-PDSO-G48
Memory Density
65536 bit
4294967296 bit
Memory IC Type
UVPROM
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
48
Number of Words
8192 words
536870912 words
Number of Words Code
8000
512000000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8KX8
512MX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Supply Current-Max
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
2.7 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Part Package Code
TSOP1
Pin Count
48
Length
18.4 mm
Programming Voltage
3.3 V
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
Terminal Pitch
0.5 mm
Type
SLC NAND TYPE
Width
12 mm
Compare AM27C64-150DCB with alternatives
Compare HY27UF084G2-TPCB with alternatives