AM27C64-150DCB vs TMS27PC256-100FML feature comparison

AM27C64-150DCB AMD

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TMS27PC256-100FML Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC TEXAS INSTRUMENTS INC
Part Package Code DIP
Package Description DIP, DIP28,.6 QCCJ, LDCC32,.5X.6
Pin Count 28
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.71
Access Time-Max 150 ns 100 ns
I/O Type COMMON COMMON
JESD-30 Code R-CDIP-T28 R-PQCC-J32
JESD-609 Code e0
Memory Density 65536 bit 262144 bit
Memory IC Type UVPROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 8192 words 32768 words
Number of Words Code 8000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP QCCJ
Package Equivalence Code DIP28,.6 LDCC32,.5X.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.75 V 13 V
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0001 A 0.00025 A
Supply Current-Max 0.025 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Base Number Matches 4 1
Length 13.97 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 3.56 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.43 mm

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