AM26LS30FN
vs
AM26LS30XC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
ADVANCED MICRO DEVICES INC
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
2
|
4
|
| High Level Input Current-Max |
0.00004 A
|
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| JESD-30 Code |
S-PQCC-J20
|
R-XUUC-N16
|
| JESD-609 Code |
e0
|
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Out Swing-Min |
2 V
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
QCCJ
|
DIE
|
| Package Equivalence Code |
LDCC20,.4SQ
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
J BEND
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
UPPER
|
| Transmit Delay-Max |
200 ns
|
200 ns
|
| Base Number Matches |
5
|
1
|
| Part Package Code |
|
DIE
|
| Package Description |
|
DIE,
|
| Pin Count |
|
16
|
| Input Characteristics |
|
STANDARD
|
| Interface Standard |
|
EIA-422; EIA-423
|
| Number of Functions |
|
4
|
| Output Polarity |
|
COMPLEMENTARY
|
| Supply Current-Max |
|
30 mA
|
| Supply Voltage-Max |
|
5.25 V
|
| Supply Voltage-Min |
|
4.75 V
|
| Supply Voltage-Nom |
|
5 V
|
|
|
|
Compare AM26LS30XC with alternatives