AM100470ADC
vs
HM4-65767BN-6:RD
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
MATRA MHS
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP18,.3
|
,
|
| Pin Count |
18
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
25 ns
|
55 ns
|
| I/O Type |
SEPARATE
|
|
| JESD-30 Code |
R-GDIP-T18
|
R-CQCC-N20
|
| JESD-609 Code |
e0
|
|
| Length |
22.86 mm
|
|
| Memory Density |
4096 bit
|
16384 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
18
|
20
|
| Number of Words |
4096 words
|
16384 words
|
| Number of Words Code |
4000
|
16000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
4KX1
|
16KX1
|
| Output Characteristics |
OPEN-EMITTER
|
3-STATE
|
| Output Enable |
NO
|
NO
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP18,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max |
0.2 mA
|
|
| Surface Mount |
NO
|
YES
|
| Technology |
ECL
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.62 mm
|
|
| Base Number Matches |
4
|
1
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
|
|
|
Compare AM100470ADC with alternatives
Compare HM4-65767BN-6:RD with alternatives