AK93C57 vs 5962-01-379-2863 feature comparison

AK93C57 Asahi Kasei Microsystems Corporation

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5962-01-379-2863 Xicor Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ASAHI KASEI MICRODEVICES CORP XICOR INC
Package Description DIP, DIP8,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Data Retention Time-Min 10 100
Endurance 10000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0
Memory Density 2048 bit 4096 bit
Memory IC Type EEPROM EEPROM
Memory Width 16 8
Number of Terminals 8 8
Number of Words 128 words 512 words
Number of Words Code 128 512
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128X16 512X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Serial Bus Type MICROWIRE I2C
Standby Current-Max 0.0001 A 0.00005 A
Supply Current-Max 0.005 mA 0.003 mA
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Write Protection HARDWARE/SOFTWARE
Base Number Matches 1 1
I2C Control Byte 1010DDMR
Supply Voltage-Nom (Vsup) 5 V

Compare AK93C57 with alternatives

Compare 5962-01-379-2863 with alternatives