ADSP-BF533SKBC600 vs ADSP-BF533SBBCZ400 feature comparison

ADSP-BF533SKBC600 Analog Devices Inc

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ADSP-BF533SBBCZ400 Analog Devices Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ANALOG DEVICES INC ANALOG DEVICES INC
Part Package Code BGA BGA
Package Description LFBGA, BGA160,14X14,32 LFBGA, BGA160,14X14,32
Pin Count 160 160
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Analog Devices Analog Devices
Additional Feature ALSO REQUIRES 2.5V OR 3.3V SUPPLY ALSO REQUIRES 3V OR 3.3V SUPPLY
Address Bus Width 20 19
Barrel Shifter YES YES
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 50 MHz 40 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B160 S-PBGA-B160
JESD-609 Code e0 e1
Length 12 mm 12 mm
Low Power Mode YES YES
Number of Terminals 160 160
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA160,14X14,32 BGA160,14X14,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Speed 600 MHz 400 MHz
Supply Voltage-Max 1.32 V 1.45 V
Supply Voltage-Min 0.8 V 0.8 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD SILVER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 12 mm 12 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 2 2
Pbfree Code No
Manufacturer Package Code BC-160-2
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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