A3P600-2PQ208Y vs A3P600-2PQ208I feature comparison

A3P600-2PQ208Y Microsemi FPGA & SoC

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A3P600-2PQ208I Microchip Technology Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROCHIP TECHNOLOGY INC
Part Package Code QFP
Package Description FQFP,
Pin Count 208
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01
JESD-30 Code S-PQFP-G208 S-PQFP-G208
Length 28 mm 28 mm
Number of CLBs 13824 13824
Number of Equivalent Gates 600000 600000
Number of Terminals 208 208
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 13824 CLBS, 600000 GATES 13824 CLBS, 600000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP FQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 4.1 mm 4.1 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 28 mm 28 mm
Base Number Matches 4 4
Rohs Code No
Clock Frequency-Max 350 MHz
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Inputs 154
Number of Outputs 154
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 20

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