A3P600-2PQ208Y
vs
A3P600-2PQG208YI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI SOC PRODUCTS GROUP
MICROCHIP TECHNOLOGY INC
Part Package Code
QFP
Package Description
FQFP,
28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208
Pin Count
208
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQFP-G208
S-PQFP-G208
Length
28 mm
28 mm
Number of CLBs
13824
13824
Number of Equivalent Gates
600000
600000
Number of Terminals
208
208
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
13824 CLBS, 600000 GATES
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
FQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
FLATPACK, FINE PITCH
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
4.1 mm
4.1 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
28 mm
28 mm
Base Number Matches
3
3
Rohs Code
Yes
Moisture Sensitivity Level
3
Number of Inputs
154
Number of Outputs
154
Peak Reflow Temperature (Cel)
245
Time@Peak Reflow Temperature-Max (s)
30
Compare A3P600-2PQ208Y with alternatives
Compare A3P600-2PQG208YI with alternatives