935310502518 vs ISO1H811G feature comparison

935310502518 NXP Semiconductors

Buy Now Datasheet

ISO1H811G Infineon Technologies AG

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS INFINEON TECHNOLOGIES AG
Package Description , 0.430 INCH, GREEN, PLASTIC, SOP-36
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-609 Code e3 e3
Moisture Sensitivity Level 3 3
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Terminal Finish TIN Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 36
Samacsys Manufacturer Infineon
Built-in Protections TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Driver Number of Bits 8
JESD-30 Code R-PDSO-G36
Length 15.9 mm
Number of Functions 1
Number of Terminals 36
Operating Temperature-Max 125 °C
Operating Temperature-Min -25 °C
Output Current Flow Direction SINK
Output Peak Current Limit-Nom 0.7 A
Package Body Material PLASTIC/EPOXY
Package Code HSSOP
Package Equivalence Code SSOP36,.56
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Qualification Status Not Qualified
Seated Height-Max 3.5 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Supply Voltage1-Max 30 V
Supply Voltage1-Min 15 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Turn-off Time 170 µs
Turn-on Time 120 µs
Width 11 mm

Compare 935310502518 with alternatives

Compare ISO1H811G with alternatives