ISO1H811G vs 935310502574 feature comparison

ISO1H811G Infineon Technologies AG

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935310502574 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description 0.430 INCH, GREEN, PLASTIC, SOP-36 ,
Pin Count 36
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Infineon
Built-in Protections TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Driver Number of Bits 8
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code R-PDSO-G36
JESD-609 Code e3 e3
Length 15.9 mm
Moisture Sensitivity Level 3 3
Number of Functions 1
Number of Terminals 36
Operating Temperature-Max 125 °C
Operating Temperature-Min -25 °C
Output Current Flow Direction SINK
Output Peak Current Limit-Nom 0.7 A
Package Body Material PLASTIC/EPOXY
Package Code HSSOP
Package Equivalence Code SSOP36,.56
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified
Seated Height-Max 3.5 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Supply Voltage1-Max 30 V
Supply Voltage1-Min 15 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish Tin (Sn) TIN
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Turn-off Time 170 µs
Turn-on Time 120 µs
Width 11 mm
Base Number Matches 1 1

Compare ISO1H811G with alternatives

Compare 935310502574 with alternatives