935249180112
vs
TDA75610LVSM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Not Recommended
Ihs Manufacturer
NXP SEMICONDUCTORS
STMICROELECTRONICS
Part Package Code
ZIP
Package Description
POWER, PLASTIC, SOT-243-1, DIL-BENT-SIL, 17 PIN
ZIP, ZIP27H,.08,.7,40
Pin Count
17
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Bandwidth-Nom
20 kHz
22 kHz
Consumer IC Type
AUDIO AMPLIFIER
AUDIO AMPLIFIER
Gain
20 dB
26 dB
Harmonic Distortion
10%
10%
JESD-30 Code
R-PZIP-T17
R-XZIP-T27
Length
23.8 mm
Number of Channels
4
4
Number of Functions
1
1
Number of Terminals
17
27
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Power-Nom
12 W
44 W
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
ZIP
ZIP
Package Equivalence Code
ZIP17,.2,.17
ZIP27H,.08,.7,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLANGE MOUNT
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
17 mm
Supply Current-Max
160 mA
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
6 V
6 V
Surface Mount
NO
NO
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
1.27 mm
1 mm
Terminal Position
ZIG-ZAG
ZIG-ZAG
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
4.4 mm
Base Number Matches
1
1
Technology
BCDMOS
Compare 935249180112 with alternatives
Compare TDA75610LVSM with alternatives